单晶铜,Single Crystal Copper
1)Single Crystal Copper单晶铜
1.Origination of Wire Breakage in Ultra-fineSingle Crystal Copper Wire Drawing and its Technical Improvement;单晶铜超微细丝的断线分析及制备工艺
2.The oxidation rate of single crystal copper wire is lower than that of poly-crystal copper wire.为了解决单晶铜线材在存储过程中的氧化问题,本文通过氧化增重实验,对不同组织、不同纯度铜线材的表面氧化行为进行了研究。
英文短句/例句
1.APPLICATION OF CRYSTAL PLASTICITY THEORY FOR MODELLING LOW CYCLIC FATIGUE OF SINGLE CRYSTAL COPPER晶体塑性模型在单晶铜低周疲劳行为中的应用
2.The Research on Continuous Casting of Single-crystal Metals Apparatus under Conditions of Vacuum Melting and Argon Shield and Preparation of Single-crystal Copper;真空熔炼氩气保护单晶连铸设备的研制及单晶铜制备
3.Development of Ohno Continuous Casting Process and Its Applications for Producing Single Crystalline Copper单晶连铸技术的发展及其在单晶铜生产中的应用
4.Simulation of Tension and Shear of Nano Single-crystal Copper Based on Molecular Dynamics;基于分子动力学的纳米单晶铜拉伸与剪切模拟
5.Unit Crystal Copper Pole Production Craft and Equipment Research and Development;单晶铜杆生产工艺及设备的研究与开发
6.Research on Design Method and Properties of Eletronic Packaging Single Crystal Copper Wire;电子封装单晶铜键合丝制备工艺及性能研究
7.Experimental Investigations on Initial Deformation Behaviors of Single Crystal Copper in Nanoindentation;单晶铜纳米压痕初始塑性变形行为实验研究
8.The Performance of Single Crystal Copper in Process of Tension and Sliding Friction Using Molecular Dynamics Simulation;单晶铜拉伸及滑动摩擦性能的分子动力学模拟
9.Molecular Dynamics Simulation of Strength of Single Crystal Cu under Different Pressure不同压力下单晶铜强度的分子动力学计算
10.Molecular Dynamics Modeling and Simulation for Nanometric Cutting of Monocrystalline Copper单晶铜纳米切削过程分子动力学建模与仿真
11.Mould Temperature Distribution in Manufacturing Single-crystal Copper by Zone Melting Heated Mould Continuous Casting区熔连铸法制备单晶铜的铸型温度场分布
12.Atomistic simulation of yield mechanism of single crystal copper nanowires单晶铜纳米线屈服机理的原子模拟研究
13.STUDY ON PRODUCING PURE COPPER SINGLE CRYSTAL INGOT BY CONTINUOUS CASTING OF SINGLE CRYSTAL METALS(CCSC);单晶连铸法制备铜单晶体的试验研究
14.The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;铜单晶体/无铅焊料的界面组织与性能
15.Study on Copper Single Crystal Grown by Vertical Bridgman Method垂直布里奇曼法生长铜单晶体的研究
16.Dislocation structures in fatigued Cu single crystals with a special single-slip orientation一个特殊单滑移取向铜单晶疲劳位错结构研究
17.Single Crystal Growth and Characterization of Mercury-based High T_C Cuprate Superconductors and Cuprous Oxide汞系铜氧化物高温超导体与氧化亚铜单晶体的生长与性质的研究
18.Radial Nanofretting of Copper Silicon and Niti Shape Memory Alloys;铜、单晶硅与镍钛形状记忆合金的径向纳动研究
相关短句/例句
single-crystal copper单晶铜
1.The results demonstrated that the surface textures ofsingle-crystal copper wire consist of〈100〉,〈112〉and〈110〉,among which the〈100〉increases from surface to center of the wire and becomes the main texture in central layer,whil.研究表明:单晶铜线材表面织构组分由〈100〉,〈112〉与〈110〉组成。
2.The technique characteristics and research status of Ohno Continuous Casting technology,as well as its application was generalized,especially forsingle-crystal copper.通过对有关文献的综述介绍了热型连铸技术的特点和目前国内外研究、应用现状,重点介绍了热型连铸技术在单晶铜生产中的应用、单晶铜的性能特点以及市场需求,提出了该技术的局限性及今后的改进方向和发展前景。
3.Theequipment to makesingle-crystal copper wire has become a critical factor.本文根据单晶铜的生长的环境要求,针对单晶铜生长的关键环节对单晶铜的设备进行了改进,使其更加有力于单晶铜的生长。
3)copper single crystal铜单晶
1.The dislocation structures in cyclically saturatedcopper single crystals oriented towards [■ 2 3]and[■ 1 2] conjugate double slip were observed and analyzed using electron-channelling contrast technique in scanning electron microscopy(SEM-ECC).利用扫描电镜电子通道衬度(SEM-ECC)技术观察和分析了[■ 2 3]和[■ 1 2]共轭双滑移取向铜单晶体的循环饱和位错结构。
2.Adiabatic shear bands (ASBs) were studied by SEM electron channeling contrast (ECC) technique, which formed in fatiguedcopper single crystals with different orientations under high velocity impact using split-Hopkinson pressure bar (SHPB).采用分离式Hopkinson压杆装置(SHPB)和扫描电镜电子通道衬度(SEM-ECC)技术研究了不同取向疲劳态铜单晶高应变率压缩下形成的绝热剪切带(ASB)。
3.Fatiguedcopper single crystal with [123] loading axis was treated by high current den- sity electropulsing, and formed two kinds of recrystallized grains with polygonal shape and 7.对疲劳后的［１２３］铜单晶体进行高电流密度脉冲处理可以形成多边形与椭同形两种再结晶晶粒、晶粒尺寸分别为７。
4)Single crystal copper铜单晶
1.The single crystal copper is casted by self made horizontal continuous casting equipment.采用自制水平单晶连铸设备制备铜单晶， 并对铜单晶的力学性能和电阻率进行了测试分析。
2.The stability factors on the single crystal copper continuous casting were researched in this paper.本文研究了铜单晶连铸过程稳定性的影响因素,考察了工艺参数对铜单晶连铸过程中铸锭表面质量与凝固组织的影响。
5)copper single crystal铜单晶体
1.The cyclic hardening behaviors ofcopper single crystals with various orientations were investigated systematically.研究了不同取向铜单晶体的循环硬化行为结果表明，晶体取向对双滑移和多滑移取向铜单晶 体的循环硬化行为有强烈的影响不同取向钢单晶体的初始循环硬化率 ００。
2.The characteristics and the corresponding dislocation structures of the deformation bands (DBs), formed in cyclically deformedcopper single crystals, were summarized systematically.:系统研究了循环变形铜单晶体中的宏观形变带的产生规律和特征以及相应的位错结构 ,并对其形成机制进行了综合探讨。
3.The changes of hysteresis loop shape parameter VH with cyclic number N in cyclicallydeformedcopper single crystals with different types of double slip orientations have been determined andsummarized systematically.本文系统测量并总结了不同类型双滑移取向铜单晶体在循环变形中滞后回线形状参数VH随循环周次N的变化关系。
6)Single crystal copper wire单晶铜丝
延伸阅读
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